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  • BSI
    PD IEC TR 62878-2-8:2021 Device embedding assembly technology - Guidelines. Warpage control of active device embedded substrate
    Edition: 2021
    $321.59
    / user per year

Description of PD IEC TR 62878-2-8:2021 2021

This part of IEC 62878 describes a warpage control of active device embedded substrate along with parameters for determining warpage, which are useful during package assembly. Warpage results are explained using warpage driving force, resistance and neutral axis, for typical die embedded substrate, where the discrete active dies are placed in the core of substrate and interconnected to the substrate by direct Cu bonding. The same principles are applicable in other device embedded substrates. Even though the detailed structure of other device embedded substrates might be different, the origin and determination of the parameters of warpage are the same and thus the purpose of this report is to help engineers improve the warpage behaviours of their products by applying this principle.



Standard NumberPD IEC TR 62878-2-8:2021
TitleDevice embedding assembly technology - Guidelines. Warpage control of active device embedded substrate
StatusDefinitive
Publication Date2021-07-29
Identical National Standard OfIEC/TR 62878-2-8 Ed.1.0
DescriptorsComponents, Substrates (insulating), Structures, Electric connectors, Electronic equipment and components
ICS31.190 Electronic component assemblies, 31.180 Printed circuits and boards
CommitteeEPL/501
ISBN978 0 539 13658 6
PublisherBSI
Pages18



About BSI

BSI Group, also known as the British Standards Institution is the national standards body of the United Kingdom. BSI produces technical standards on a wide range of products and services and also supplies certification and standards-related services to businesses.
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