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Description of BS IEC 62396-5:2014 2014The purpose of this part of IECÂ 62396 is to provide a more precise definition of the threat that thermal neutrons pose to avionics as a second mechanism for inducing single event upset (SEU) in microelectronics. There are two main points that will be addressed in this part of IECÂ 62396 :
The net result of the reviews of these two different sets of data will be two ratios that are considered to be very important for leading to the ultimate objective of how large a threat is the SEU rate from thermal neutrons compared to the SEU threat from the high energy neutrons ( E >10 MeV). The threat from the high energy neutrons has been dealt with extensively in the literature and has been addressed by two standards ( IEC 62396‑1 in avionics and JESD89A [1] 1 in microelectronics on the ground). Neutrons with E > 1 MeV are considered for parts with geometries below 150 nm. NOTE Reference is made to IEC 62396‑1:2012, 5.3.2, for smaller geometry parts below 150 nm which provides the neutron flux for energies above 1 MeV.
About BSIBSI Group, also known as the British Standards Institution is the national standards body of the United Kingdom. BSI produces technical standards on a wide range of products and services and also supplies certification and standards-related services to businesses. |
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