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  • BSI
    BS EN IEC 60749-37:2022 - TC Tracked Changes. Semiconductor devices. Mechanical and climatic test methods - Board level drop test method using an accelerometer
    Edition: 2022
    $538.36
    / user per year

Description of BS EN IEC 60749-37:2022 - TC 2022

IEC 60749-37:2022 is available as IEC 60749-37:2022 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60749-37:2022 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test. This edition includes the following significant technical changes with respect to the previous edition: - correction of a previous technical error concerning test conditions; - updates to reflect improvements in technology.

Standard NumberBS EN IEC 60749-37:2022 - TC
TitleTracked Changes. Semiconductor devices. Mechanical and climatic test methods - Board level drop test method using an accelerometer
StatusDefinitive
Publication Date2022-12-20
DescriptorsAccelerometers, Reports, Testing, Electrical failure, Failure analysis, Printed-circuit boards, Electronic components, Semiconductor devices, Semiconductors
ICS31.080.01 Semiconductor devices in general
CommitteeEPL/47
ISBN978 0 539 25325 2
PublisherBSI
Pages60



About BSI

BSI Group, also known as the British Standards Institution is the national standards body of the United Kingdom. BSI produces technical standards on a wide range of products and services and also supplies certification and standards-related services to businesses.
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