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BSI
BS EN IEC 60749-10:2022 - TC Tracked Changes. Semiconductor devices. Mechanical and climatic test methods - Mechanical shock. device and subassembly
Edition: 2022
Description of BS EN IEC 60749-10:2022 - TC 2022
IEC 60749-10:2022 is intended to evaluate devices in the free state
and assembled to printed wiring boards for use in electrical
equipment. The method is intended to determine the compatibility of
devices and subassemblies to withstand moderately severe shocks.
The use of subassemblies is a means to test devices in usage
conditions as assembled to printed wiring boards. Mechanical shock
due to suddenly applied forces, or abrupt change in motion produced
by handling, transportation or field operation can disturb
operating characteristics, particularly if the shock pulses are
repetitive. This is a destructive test intended for device
qualification. This edition cancels and replaces the first edition
published in 2002. This edition includes the following significant
technical changes with respect to the previous edition: - covers both unattached components and
components attached to printed wiring boards;
- tolerance limits modified for peak
acceleration and pulse duration;
- mathematical formulae added for
velocity change and equivalent drop height.
About BSI
BSI Group, also known as the British Standards Institution is the national standards body of the United Kingdom. BSI produces technical standards on a wide range of products and services and also supplies certification and standards-related services to businesses.
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