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  • BSI
    BS EN 62137-1-4:2009 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint - Cyclic bending test
    Edition: 2009
    $305.31
    / user per year

Description of BS EN 62137-1-4:2009 2009

The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate.

Standard NumberBS EN 62137-1-4:2009
TitleSurface mounting technology. Environmental and endurance test methods for surface mount solder joint - Cyclic bending test
StatusDefinitive
Publication Date2009-03-31
Identical National Standard OfEN 62137-1-4:2009, IEC 62137-1-4:2009
DescriptorsBend testing, Mechanical testing, Surface mounting, Surface mounting devices, Soldered joints, Cyclic, Integrated circuits, Endurance testing, Environmental testing, Soldering, Printed-circuit boards
ICS31.190 Electronic component assemblies, 29.080 Insulation, 45.020 Railway engineering in general
CommitteeEPL/501
ISBN978 0 580 59252 2
PublisherBSI
Pages18



About BSI

BSI Group, also known as the British Standards Institution is the national standards body of the United Kingdom. BSI produces technical standards on a wide range of products and services and also supplies certification and standards-related services to businesses.
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