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  • BSI
    BS EN 60068-2-58:2015+A1:2018 Environmental testing - Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    Edition: 2018
    $511.56
    / user per year

Description of BS EN 60068-2-58:2015+A1:2018 2018

This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD).

A1_startThis document provides procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.A1_end

The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow systems.

The solder bath method is applicable to SMDs designed for flow soldering and SMDs designed for reflow soldering when the solder bath (dipping) method is appropriate.

The reflow method is applicable to the SMD designed for reflow soldering, to determine the suitability of SMDs for reflow soldering and when the solder bath (dipping) method is not appropriate.

The objective of this standard is to ensure solderability of component lead or termination. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering.

This standard covers tests Td1, Td2 and Td3 as listed below:

Number of Td Test Method
Td1 Solderability of terminations Method 1: Solder bath

Method 2: Reflow
Td2 Resistance to soldering heat Method 1: Solder bath

Method 2: Reflow
Td3 Dewetting and resistance to dissolution of metallization Method 1: Solder bath

Method 2: Reflow

NOTE 1 For specific components other test methods may exist.

NOTE 2 Test Td does not apply to printed wiring board (PWB), see IEC 61189-3.

NOTE 3 Specific through-hole devices (where the device supplier has specifically documented support for reflow soldering) are also included in this standard.



Standard NumberBS EN 60068-2-58:2015+A1:2018
TitleEnvironmental testing - Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
StatusDefinitive
Publication Date2018-05-21
ReplacesBS EN 60068-2-58:2004
Identical National Standard OfIEC 60068-2-58:2015/AMD1:2017, IEC 60068-2-58:2015/AMD1:2017, EN 60068-2-58:2015/A1:2018
AmendsBS EN 60068-2-58:2015
DescriptorsEnvironmental testing, Impact testing, Accuracy, Electrical equipment, Test duration, Mechanical testing, Testing conditions, Electronic equipment and components, Test equipment, Electrical components
ICS31.190 Electronic component assemblies, 19.040 Environmental testing
CommitteeEPL/501
ISBN978 0 580 95578 5
PublisherBSI
Pages46



About BSI

BSI Group, also known as the British Standards Institution is the national standards body of the United Kingdom. BSI produces technical standards on a wide range of products and services and also supplies certification and standards-related services to businesses.
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