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eLibrary > BS EN IEC 63378-6:2026 Thermal standardization on semiconductor packages - Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points >

BS EN IEC 63378-6:2026 Thermal standardization on semiconductor packages - Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points, 2026

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BS EN IEC 63378-6:2026 Thermal standardization on semiconductor packages - Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points, 2026