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eLibrary > BS EN IEC 62228-5:2021 Integrated circuits. EMC evaluation of transceivers - Ethernet transceivers >

BS EN IEC 62228-5:2021 Integrated circuits. EMC evaluation of transceivers - Ethernet transceivers, 2021

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BS EN IEC 62228-5:2021 Integrated circuits. EMC evaluation of transceivers - Ethernet transceivers, 2021

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Annex ZA(normative)Normative references to international publicationswith their corresponding European publications
CONTENTS
FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms [Go to Page]
3.1 Terms and definitions
3.2 Abbreviated terms
4 General
Tables [Go to Page]
Table 1 – Overview of measurements and tests
5 Test and operating conditions [Go to Page]
5.1 Supply and ambient conditions
5.2 Test operation modes [Go to Page]
5.2.1 General
Table 2 – Supply and ambient conditions for functional operation [Go to Page]
5.2.2 Transceiver configuration for normal operation mode
5.2.3 Transceiver configuration for low power mode
5.3 Definition of BIN
Table 3 – Definition for transceiver configuration for normal operation mode
Table 4 – Definition for transceiver mode configuration for low power mode
5.4 Test configuration [Go to Page]
5.4.1 General configuration for transceiver network
Figures [Go to Page]
Figure 1 – Minimum MDI interface test network (Min-BIN)
Figure 2 – Standard MDI interface test network (Std-BIN)
Figure 3 – Optimized MDI interface test network (Opt-BIN)
Figure 4 – General test configuration for testsin transceiver network for conducted tests [Go to Page]
5.4.2 General configuration for single transceiver
5.4.3 Transceiver network tests – coupling ports and networks for conducted tests
Figure 5 – General test configuration for unpowered ESD test
Table 5 – Selection recommendation of MII interfacesfor transceiver network configuration
Figure 6 – Transceiver network tests – coupling ports and networks
Table 6 – Transceiver network tests – component value definitionsof coupling ports and networks [Go to Page]
5.4.4 Single transceiver tests – coupling ports and networks
5.5 Test communication and signals [Go to Page]
5.5.1 General
5.5.2 Test signals for normal operation mode
Figure 7 – Coupling ports and networks for unpowered ESD tests
Table 7 – Definitions of coupling ports for unpowered ESD tests [Go to Page]
5.5.3 Test signals for low power mode
5.6 Evaluation criteria [Go to Page]
5.6.1 General
5.6.2 Evaluation criteria for functional operation modes
Table 8 – Definition for transceiver mode configuration for normal operation mode [Go to Page]
5.6.3 Evaluation criteria in unpowered condition after exposure to disturbances
Table 9 – Evaluation criteria for Ethernet transceiver [Go to Page]
5.6.4 Status classes
Figure 8 – Principle drawing of the maximum deviation on an IV characteristic
Table 10 – Definition of functional status classes
5.7 DUT specific information
6 Test and measurement [Go to Page]
6.1 Emission of conducted RF disturbances [Go to Page]
6.1.1 Test method
6.1.2 Test setup
6.1.3 Test procedure and parameters
Figure 9 – Test setup for measurement of conducted RF disturbances
Table 11 – Settings of the conducted RF measurement equipment
6.2 Immunity to conducted RF disturbances [Go to Page]
6.2.1 Test method
6.2.2 Test setup
Table 12 – Conducted emission measurements [Go to Page]
6.2.3 Test procedure and parameters
Figure 10 – Test setup for DPI tests
Table 13 – Specifications for DPI tests
Table 14 – DPI tests for functional status class AIC evaluationof Ethernet transceivers
Table 15 – DPI tests for functional status class CIC or DIC evaluationof Ethernet transceivers
6.3 Immunity to impulses [Go to Page]
6.3.1 Test method
6.3.2 Test setup
Figure 11 – Test setup for impulse immunity tests [Go to Page]
6.3.3 Test procedure and parameters
Table 16 – Specifications for impulse immunity tests
Table 17 – Parameters for impulse immunity test
Table 18 – Impulse immunity tests for functional status class AIC evaluationof Ethernet transceivers
Table 19 – Impulse immunity tests for functional status class CIC or DIC evaluation of Ethernet transceivers
6.4 Electrostatic Discharge (ESD) [Go to Page]
6.4.1 Test method
6.4.2 Test setup
Figure 12 – Test setup for powered ESD tests – principle arrangement
Figure 13 – Test setup for powered ESD tests – stimulation and monitoring
Figure 14 – Test setup for unpowered ESD tests – principle arrangement
Figure 15 – Test setup for unpowered ESD tests – stimulation and monitoring for function validation pre and post ESD test [Go to Page]
6.4.3 Test procedure and parameters
Table 20 – Specifications for ESD tests
Table 21 – ESD tests in powered mode for functional status class AIC, CICand DIC evaluation of Ethernet transceivers
7 Test report [Go to Page]
Table 22 – ESD tests in unpowered mode for functional status class DIC evaluationof Ethernet transceiver ICs
Annex A (normative)Ethernet test circuits [Go to Page]
A.1 General
A.2 Test circuit for Ethernet transceivers for functional tests
Figure A.1 – General drawing of the circuit diagram of test networkfor 100BASE-T1 and 1000BASE-T1 Ethernet transceivers for functionaltest using conducted test methods
A.3 Test circuit for Ethernet transceivers for ESD test
Figure A.2 – General drawing of the circuit diagram of test networkfor 100BASE-TX Ethernet transceivers for functional test using conducted test methods
Figure A.3 – General drawing of the circuit diagram forESD tests of Ethernet transceivers in powered mode
Figure A.4 – General drawing of the circuit diagram for ESD tests of Ethernet transceivers in unpowered mode
Annex B (normative)Test circuit boards [Go to Page]
B.1 Test circuit board for transceiver network configuration
Figure B.1 – Example of functional conducted test boardfor Ethernet transceiver ICs (100BASE-T1)
Figure B.2 – Example of powered ESD test boardfor Ethernet transceivers ICs (100BASE-T1)
B.2 Test circuit board for single transceiver configuration
Figure B.3 – Example of unpowered ESD test boardfor Ethernet transceivers ICs (100BASE-T1), top layer
Figure B.4 – Example of unpowered ESD test boardfor Ethernet transceivers ICs (100BASE-T1), bottom layer
Table B.1 – Parameter ESD test circuit board
Annex C (informative)Test of Ethernet transceiver for radiated RF emission and RF immunity [Go to Page]
C.1 General
C.2 General configuration for transceiver network
Figure C.1 – General test configuration for testsin transceiver network used for radiated tests
C.3 Tests [Go to Page]
C.3.1 General
Figure C.2 – General drawing of the circuit diagram of test network for 100BASE-T1 and 1000BASE-T1 Ethernet transceivers for functional test using radiated RF test methods
Figure C.3 – Example of functional radiated test board for Ethernettransceiver ICs (100BASE-T1), top layer (DUT side)
Figure C.4 – Example of functional radiated test board for Ethernettransceiver ICs (100BASE-T1), bottom layer (external circuitry side) [Go to Page]
C.3.2 Emission of radiated RF disturbances
Figure C.5 – Test setup for measurement of radiated RF emission [Go to Page]
C.3.3 Immunity to radiated RF disturbances
Table C.1 – Settings of the radiated RF measurement equipment
Table C.2 – Radiated RF emission measurements
Figure C.6 – Test setup for radiated RF immunity tests
Table C.3 – Specifications for radiated RF immunity tests
Table C.4 – Radiated RF immunity tests for functionalstatus class AIC evaluation of Ethernet transceivers
Annex D (informative)Examples for test limits for Ethernet transceiverin automotive application [Go to Page]
D.1 General
D.2 Emission of conducted RF disturbances
Figure D.1 – Example of limits for conducted RF emission –MDI Opt-BIN, VBAT and WAKE
D.3 Immunity to conducted RF disturbances
Figure D.2 – Example of limits for conducted RF emission – local supplies
Table D.1 – Example of limits for conducted RF emission –test cases with recommended limit classes
Figure D.3 – Example of limits for conducted RF immunityfor functional status class AIC – MDI Opt-BIN
Figure D.4 – Example of limits for conducted RF immunityfor functional status class AIC – VBAT and WAKE
Table D.2 – Example of limits for conducted RF immunity –test cases with recommended limit classes for functional status class AIC
Figure D.5 – Example of limits for conducted RF immunityfor functional status class CIC or DIC – MDI Opt-BIN
Figure D.6 – Example of limits for conducted RF immunityfor functional status class CIC or DIC – VBAT and WAKE
D.4 Immunity to impulses
D.5 Electrostatic discharge (ESD)
Table D.3 – Example of limits for conducted RF immunity –test cases with recommended limit classes for functional status class CIC or DIC
Table D.4 – Example of limits for impulse immunity – Class I
Table D.5 – Example of limits for impulse immunity –test cases with recommended limit classes for functional status class CIC or DIC
D.6 Emission of radiated RF disturbances
Figure D.7 – Example of limits for radiated RF emissionfor IC stripline with 6,7 mm active conductor height
Table D.6 – Example of limits for powered and unpowered ESD tests – test cases with recommended limits for functional status class A1IC, A2IC, A3IC, CIC or DIC
D.7 Immunity to radiated RF disturbances
Figure D.8 – Example of limits for radiated RF immunity
Table D.7 – Example of limits for radiated RF emission –test cases with recommended limit classes
Table D.8 – Example of limits for radiated RF immunity –test cases with recommended limit classes
Annex E (informative)Characterization of common mode chokesfor EMC evaluation of Ethernet transceivers [Go to Page]
E.1 General
E.2 Test [Go to Page]
E.2.1 General
Figure E.1 – General electrical drawing of a CMC [Go to Page]
E.2.2 S-parameter measurement mixed mode
Figure E.2 – Test setup for S-parameter measurements at CMC
Figure E.3 – Example of test board 4-port S-parameter measurement at CMC –mixed mode, top layer
Figure E.4 – Example of test board 3-port S-parameter measurement at CMC –single ended, top layer
Table E.1 – Test procedure and parametersfor 3-port test board characterization for CMC
Table E.2 – Test procedure and parameters for S-parameter measurements at CMC
Figure E.5 – Recommended characteristics for Sdd11, Sdd22 (RL) for CMC
Table E.3 – Required S-parameter measurements for CMC
Figure E.6 – Recommended characteristics for Sdd21 (IL) for CMC
Figure E.7 – Recommended characteristics for Scc21 (CMR) for CMC
Figure E.8 – Recommended characteristics for Sdc11, Sdc22 (LCL) for CMC
Figure E.9 – Recommended characteristics for Ssd21, Ssd12 (DCMR)and Sds21, Sds12 (CDMR) for CMC [Go to Page]
E.2.3 ESD damage
Figure E.10 – Test setup for ESD damage tests at CMC
Figure E.11 – Example of ESD test board for CMC, top layer
Table E.4 – Test parameters for ESD damage tests at CMC [Go to Page]
E.2.4 Saturation test at RF disturbances
Table E.5 – Required ESD tests for damage for CMC
Figure E.12 – Test setup for RF saturation measurements at CMC
Figure E.13 – Example of RF saturation / S-parameter test board for CMC, top layer
Table E.6 – Test procedure and parameters for RF saturation tests at CMC
Table E.7 – Required RF saturation tests for CMC [Go to Page]
E.2.5 Saturation test at ESD
Figure E.14 – Test setup for ESD saturation measurements at CMC
Figure E.15 – Example of ESD saturation test board for CMC, top layer
Table E.8 – Test procedure and parameters for ESD saturation tests at CMC
Table E.9 – Required ESD saturation tests for CMC
Table E.10 – ESD saturation break down voltage classes for CMC [Go to Page]
E.2.6 TDR measurement of differential mode impedance
Figure E.16 – Example of ESD saturation tests results for CMC
Figure E.17 – Test setup for TDR measurement at CMC
Figure E.18 – Example of TDR test board for CMC, top layer
Table E.11 – Test procedure and parameters for TDR measurement at CMC
Table E.12 – Required TDR measurements for CMC
Annex F (informative)Characterization of ESD suppression devicesfor EMC evaluation of Ethernet transceivers [Go to Page]
F.1 General
Table F.1 – Specification of ESD suppression device
F.2 Test [Go to Page]
F.2.1 General
Figure F.1 – Arrangement of ESD suppression devicewithin the 100BASE-T1 and 1000BASE-T1 MDI interface [Go to Page]
F.2.2 S-parameter measurement mixed mode
Figure F.2 – Test setup for S-parameter measurements at ESD suppression device
Figure F.3 – Example of test board 4-port S-parameter measurementfor ESD suppression device – mixed mode, top layer
Figure F.4 – Example of test board 3-port S-parameter measurementfor ESD suppression device – single ended, top layer
Table F.2 – Test procedure and parameters for 3-port test boardcharacterization for ESD suppression device
Table F.3 – Test procedure and parameters for S-parametermeasurements at ESD suppression device
Table F.4 – Required S-parameter measurements for ESD suppression device
Figure F.5 – Recommended characteristics for Sdd11 (RL) for ESD suppression device
Figure F.6 – Recommended characteristics for Sdd21 (IL) for ESD suppression device
Figure F.7 – Recommended characteristics for Ssd21 (DCMR)for ESD suppression device [Go to Page]
F.2.3 ESD damage
Figure F.8 – Test setup for ESD damage tests at ESD suppression device
Figure F.9 – Example of ESD test board for ESD suppression device, top layer
Table F.5 – Test parameters for ESD damage tests at ESD suppression device
Table F.6 – Required ESD tests for damage for ESD suppression device [Go to Page]
F.2.4 ESD discharge current measurement
Figure F.10 – Test setup for ESD discharge current measurementat ESD suppression device
Figure F.11 – Example of ESD discharge current test boardfor ESD suppression device, top and bottom layer
Table F.7 – Test parameters for ESD discharge currentmeasurement at ESD suppression device
Table F.8 – Required current measurement for ESD suppression device
Figure F.12 – Example of test results and recommended limits for remaining ESD discharge current after the MDI test network for ESD suppression device
Table F.9 – Recommended limits for remaining ESD discharge currentafter the MDI test network for ESD suppression device [Go to Page]
F.2.5 Test of unwanted clamping effect at RF immunity tests
Figure F.13 – Test setup for RF clamping test at ESD suppression device
Table F.10 – Limit classes and related applied ESD test voltages
Figure F.14 – Example of test board RF clamping test at suppression device, top layer
Table F.11 – Test procedure and parameters for RF clampingtests at ESD suppression device
Figure F.15 – Recommended test power levels for RF clampingtests at ESD suppression device
Table F.12 – Required RF clamping tests for ESD suppression device
Bibliography [Go to Page]

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