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TOC Search:
BS EN 16603-20-08:2023 Space engineering. Photovoltaic assemblies and components, 2023
- undefined
- 1 Scope
- 2 Normative references
- 3 Terms, definitions and abbreviated terms [Go to Page]
- 3.1 Terms from other standards
- 3.2 Terms specific to the present standard
- 3.3 Abbreviated terms
- 3.4 Nomenclature
- 4 General [Go to Page]
- 4.1 Overview [Go to Page]
- 4.1.1 Objective and organization
- 4.1.2 Interfaces with other areas
- 4.2 Physical properties
- 4.3 Test and storage [Go to Page]
- 4.3.1 Test environment
- 4.3.2 Test tolerances and accuracies
- 4.3.3 <
> - 4.4 Critical materials
- 5 Photovoltaic assemblies [Go to Page]
- 5.1 Overview [Go to Page]
- 5.1.1 Description
- 5.1.2 Purpose and objective
- 5.2 Conditions and method of test
- 5.3 Photovoltaic assembly design [Go to Page]
- 5.3.1 Overview
- 5.3.2 Parameters related to parts, materials and processes (PMP) [Go to Page]
- 5.3.2.1 Outgassing
- 5.3.2.2 Toxicity
- 5.3.2.3 Flammability
- 5.3.2.4 Corrosion
- 5.3.2.5 Magnetism
- 5.3.2.6 Erosion
- 5.3.2.7 Atomic oxygen (ATOX)
- 5.3.3 Parameters related to design [Go to Page]
- 5.3.3.1 Cell integration
- 5.3.3.2 Stringing
- 5.3.3.3 Cell interspacing
- 5.3.3.4 Sectioning
- 5.3.3.5 Reverse bias protection
- 5.3.3.6 Insulation
- 5.3.3.7 Derating
- 5.3.3.8 Redundancy
- 5.3.3.9 Fault tolerance
- 5.3.3.10 Fatigue resistance
- 5.3.3.11 Adherence to substrate
- 5.3.3.12 Adhesive uniformity
- 5.3.3.13 Electrostatic discharge (ESD)
- 5.3.3.14 Electromagnetic compatibility (EMC)
- 5.3.3.15 Repairability
- 5.4 PVA manufacturing [Go to Page]
- 5.4.1 Process validation
- 5.4.2 Defect acceptability
- 5.4.3 In-process testing [Go to Page]
- 5.4.3.1 Overview
- 5.4.3.2 Mass measurement
- 5.4.3.3 Wet insulation test
- 5.4.3.4 Adherence to substrate
- 5.4.3.5 Visual inspection
- 5.4.3.6 Continuity check
- 5.4.4 Identification and traceability
- 5.4.5 Recording
- 5.5 PVA tests [Go to Page]
- 5.5.1 Qualification tests [Go to Page]
- 5.5.1.1 Purpose
- 5.5.1.2 Process
- 5.5.1.3 Fatigue thermal cycling test
- 5.5.1.4 Humidity
- 5.5.1.5 Electrostatic discharge (ESD) test
- 5.5.1.6 Erosion of materials
- 5.5.1.7 EMC
- 5.5.2 Acceptance tests for qualification coupons [Go to Page]
- 5.5.2.1 Purpose
- 5.5.2.2 Applicability
- 5.5.2.3 Deliverables
- 5.5.2.4 Process
- 5.5.3 Definition of tests and checks [Go to Page]
- 5.5.3.1 Add-on mass measurement
- 5.5.3.2 Full visual inspection
- 5.5.3.3 Electrical health check
- 5.5.3.4 Electrical performance measurement
- 5.5.3.5 Capacitance test
- 5.5.3.6 Bake-out
- 5.5.3.7 Thermal cycling acceptance test
- 5.5.3.8 Reflectance
- 5.5.3.9 X-Ray
- 5.5.3.10 Substrate integrity
- 5.5.3.11 Vacuum thermal cycling
- 5.6 Failure definition [Go to Page]
- 5.6.1 Failure criteria
- 5.6.2 Failed qualification coupons
- 5.7 Data documentation
- 5.8 Delivery
- 5.9 Packaging, packing, handling and storage
- 6 Solar cell assemblies [Go to Page]
- 6.1 General [Go to Page]
- 6.1.1 Testing
- 6.1.2 Conditions and methods of test
- 6.1.3 Deliverable components
- 6.1.4 Identification and traceability
- 6.2 Production control (process identification document)
- 6.3 Acceptance tests [Go to Page]
- 6.3.1 General
- 6.3.2 Test methods and conditions
- 6.3.3 Electrical performance acceptance test (EPA) [Go to Page]
- 6.3.3.1 Purpose
- 6.3.3.2 Process
- 6.3.3.3 Pass-fail criteria
- 6.4 Qualification tests [Go to Page]
- 6.4.1 General
- 6.4.2 Qualification [Go to Page]
- 6.4.2.1 Production and test schedule
- 6.4.2.2 Qualification test samples
- 6.4.2.3 Qualification testing
- 6.4.3 Test methods, conditions and measurements [Go to Page]
- 6.4.3.1 Full visual inspection including ELM (VI)
- 6.4.3.2 Dimensions and weight (DW)
- 6.4.3.3 Electrical performance (EP)
- 6.4.3.4 Temperature coefficients (TC)
- 6.4.3.5 Spectral response (SR)
- 6.4.3.6 Thermo-optical data (TO)
- 6.4.3.7 Thermal cycling (CY)
- 6.4.3.8 Humidity and temperature (HT1)
- 6.4.3.9 Coating adherence (CA)
- 6.4.3.10 Interconnector adherence (IA)
- 6.4.3.11 Electron irradiation (EI)
- 6.4.3.12 Photon irradiation and temperature annealing (PH)
- 6.4.3.13 Surface conductivity (SC)
- 6.4.3.14 Solar Cell Reverse Bias Test (RB)
- 6.4.3.15 Ultraviolet exposure test (UV)
- 6.4.3.16 Capacitance test (CT)
- 6.4.3.17 Flatness test (FT)
- 6.4.3.18 Long Duration - Life test (LT)
- 6.4.3.19 Angular Measurement (AM)
- 6.5 Failure definition [Go to Page]
- 6.5.1 Failure criteria
- 6.5.2 Failed SCAs
- 6.6 Data documentation
- 6.7 Delivery
- 6.8 Packing, dispatching, handling and storage [Go to Page]
- 6.8.1 Overview
- 6.8.2 ESD Sensitivity
- 7 Bare solar cells [Go to Page]
- 7.1 Testing, deliverable components and marking [Go to Page]
- 7.1.1 Testing [Go to Page]
- 7.1.1.1 Tests for qualification and procurement
- 7.1.1.2 Conditions and methods of tests
- 7.1.1.3 Responsibility of supplier for the performance of tests and inspections
- 7.1.1.4 Preliminary characterization
- 7.1.2 Deliverable components
- 7.1.3 Marking
- 7.2 Production control (process identification document)
- 7.3 Acceptance tests [Go to Page]
- 7.3.1 General
- 7.3.2 Test methods and conditions [Go to Page]
- 7.3.2.1 Test other than electrical performance
- 7.3.2.2 Electrical performance
- 7.3.3 Documentation
- 7.4 Qualification tests [Go to Page]
- 7.4.1 General
- 7.4.2 Qualification [Go to Page]
- 7.4.2.1 Production and test schedule
- 7.4.2.2 Qualification test samples
- 7.4.2.3 Qualification testing
- 7.5 Test methods, conditions and measurements [Go to Page]
- 7.5.1 Visual inspection including ELM (VI) [Go to Page]
- 7.5.1.1 Applicability
- 7.5.1.2 Test process
- 7.5.1.3 Deviations
- 7.5.1.4 Solar cell defects
- 7.5.1.5 Solar cell contact area defects
- 7.5.2 Dimensions and weight (DW)
- 7.5.3 Electrical performance (EP) [Go to Page]
- 7.5.3.1 Purpose
- 7.5.3.2 Process
- 7.5.4 Temperature coefficients (TC)
- 7.5.5 Spectral response (SR) [Go to Page]
- 7.5.5.1 Purpose
- 7.5.5.2 Process
- 7.5.6 Optical properties (OP) [Go to Page]
- 7.5.6.1 Overview
- 7.5.6.2 Hemispherical reflectance (HR)
- 7.5.6.3 Coverglass gain-loss (GL)
- 7.5.6.4 Solar absorptance (as)
- 7.5.7 Humidity and temperature (HT) [Go to Page]
- 7.5.7.1 HT1 for qualification testing (subgroup O)
- 7.5.7.2 HT2 for qualification (subgroup A) and acceptance testing
- 7.5.8 Coating adherence (CA) [Go to Page]
- 7.5.8.1 Purpose
- 7.5.8.2 Process
- 7.5.9 Contact uniformity (CU) [Go to Page]
- 7.5.9.1 Purpose
- 7.5.9.2 Process
- 7.5.9.3 Pass fail criteria
- 7.5.10 Contact thickness (CT) [Go to Page]
- 7.5.10.1 Purpose
- 7.5.10.2 Process
- 7.5.10.3 Pass fail criteria
- 7.5.11 Surface finish (SF) [Go to Page]
- 7.5.11.1 Purpose
- 7.5.11.2 Process
- 7.5.11.3 Pass fail criteria
- 7.5.12 Pull test (PT) [Go to Page]
- 7.5.12.1 Purpose
- 7.5.12.2 Process
- 7.5.13 Electron irradiation (EI) [Go to Page]
- 7.5.13.1 Purpose
- 7.5.13.2 Process
- 7.5.14 Proton irradiation (PI) [Go to Page]
- 7.5.14.1 Purpose
- 7.5.14.2 Process
- 7.5.15 Photon irradiation and temperature annealing (PH) [Go to Page]
- 7.5.15.1 Purpose
- 7.5.15.2 Process
- 7.5.16 Solar cell reverse bias test (RB) [Go to Page]
- 7.5.16.1 Purpose
- 7.5.16.2 Process
- 7.5.16.3 Pass-fail criteria
- 7.5.17 Thermal cycling (CY) [Go to Page]
- 7.5.17.1 Purpose
- 7.5.17.2 Process
- 7.5.18 Active-passive interface evaluation test (IF) [Go to Page]
- 7.5.18.1 Purpose
- 7.5.18.2 Process
- 7.5.19 Flatness test (FT) [Go to Page]
- 7.5.19.1 Purpose
- 7.5.19.2 Process
- 7.5.19.3 Pass/fail criteria.
- 7.6 Failure definition [Go to Page]
- 7.6.1 Failure criteria
- 7.6.2 Failed components
- 7.7 Data documentation
- 7.8 Delivery
- 7.9 Packing, dispatching, handling and storage [Go to Page]
- 7.9.1 Overview
- 7.9.2 ESD Sensitivity
- 8 Coverglasses [Go to Page]
- 8.1 Overview [Go to Page]
- 8.1.1 Purpose
- 8.1.2 Description
- 8.2 Interfaces
- 8.3 Testing, deliverable components and marking [Go to Page]
- 8.3.1 Testing [Go to Page]
- 8.3.1.1 Tests for qualification and procurement
- 8.3.1.2 Conditions and methods of tests
- 8.3.1.3 Responsibility of supplier for the performance of tests and inspections
- 8.3.2 Deliverable components
- 8.3.3 Marking (coating orientation)
- 8.4 Production control (Process identification document)
- 8.5 Acceptance test [Go to Page]
- 8.5.1 Acceptance test samples
- 8.5.2 Acceptance test sequence
- 8.5.3 Test methods and conditions
- 8.5.4 Documentation
- 8.6 Qualification tests [Go to Page]
- 8.6.1 General
- 8.6.2 Qualification [Go to Page]
- 8.6.2.1 Production and test schedule
- 8.6.2.2 Qualification test samples
- 8.6.2.3 Qualification testing
- 8.7 Test methods, conditions and measurements [Go to Page]
- 8.7.1 Visual inspection (VI) [Go to Page]
- 8.7.1.1 General
- 8.7.1.2 Deviations
- 8.7.1.3 Defects
- 8.7.2 Transmission into air (TA)
- 8.7.3 Electro-optical properties (EO) [Go to Page]
- 8.7.3.1 Bulk and surface resistivity
- 8.7.3.2 Refractive index
- 8.7.4 Mechanical properties (MP) [Go to Page]
- 8.7.4.1 Dimension and weight
- 8.7.4.2 Density
- 8.7.4.3 Thickness
- 8.7.4.4 Edge parallelism
- 8.7.4.5 Perpendicularity of sides
- 8.7.5 Reflectance properties (OP) [Go to Page]
- 8.7.5.1 Reflectance
- 8.7.5.2 Reflectance cut-on
- 8.7.5.3 Reflectance cut-off
- 8.7.5.4 Reflectance bandwidth
- 8.7.6 Normal emittance (NE)
- 8.7.7 Surface resistivity (SC)
- 8.7.8 Flatness or bow (FT)
- 8.7.9 Transmission into adhesive (TH)
- 8.7.10 Boiling water test (BW)
- 8.7.11 Humidity and temperature [Go to Page]
- 8.7.11.1 HT3 for qualification testing (subgroup O)
- 8.7.11.2 HT4 for acceptance testing
- 8.7.12 UV exposure (UV) [Go to Page]
- 8.7.12.1 Purpose
- 8.7.12.2 Process
- 8.7.13 Electron irradiation (EI) [Go to Page]
- 8.7.13.1 Purpose
- 8.7.13.2 Process
- 8.7.14 Proton irradiation (PI) [Go to Page]
- 8.7.14.1 Purpose
- 8.7.14.2 Process
- 8.7.15 Breaking strength (BS)
- 8.7.16 Thermal cycling (CY)
- 8.7.17 Abrasion resistance (coated surface) (AE)
- 8.7.18 Coating adhesion (TD)
- 8.8 Failure definition [Go to Page]
- 8.8.1 Failure criteria
- 8.8.2 Failed components
- 8.9 Data documentation
- 8.10 Delivery
- 8.11 Packing, dispatching, handling and storage
- 9 Solar cell protection diodes [Go to Page]
- 9.1 Overview
- 9.2 Testing, deliverable components and marking [Go to Page]
- 9.2.1 Testing [Go to Page]
- 9.2.1.1 Tests for qualification and procurement
- 9.2.1.2 Conditions and methods of tests
- 9.2.1.3 Responsibility of supplier for the performance of tests and inspections
- 9.2.2 Deliverable components [Go to Page]
- 9.2.2.1 Integral protection diodes
- 9.2.2.2 External protection diodes
- 9.2.3 Marking
- 9.3 Production control (process identification document) [Go to Page]
- 9.3.1 Integral protection diodes
- 9.3.2 External protection diodes
- 9.4 Acceptance tests [Go to Page]
- 9.4.1 General
- 9.4.2 Integral protection diodes
- 9.4.3 External protection diodes
- 9.4.4 External and integral diodes
- 9.4.5 Test methods and conditions [Go to Page]
- 9.4.5.1 Production and test schedule
- 9.4.5.2 Diode characterization for acceptance (DCA)
- 9.4.6 Documentation
- 9.5 Qualification tests [Go to Page]
- 9.5.1 General
- 9.5.2 Integral protection diodes
- 9.5.3 External protection diodes
- 9.5.4 Integral and external protection diodes [Go to Page]
- 9.5.4.1 Production and test schedule
- 9.5.4.2 Qualification test samples
- 9.5.4.3 Qualification testing
- 9.6 Test methods, conditions and measurements [Go to Page]
- 9.6.1 General
- 9.6.2 Visual inspection (VI) [Go to Page]
- 9.6.2.1 Applicability
- 9.6.2.2 Test process
- 9.6.2.3 Deviations
- 9.6.2.4 Protection diode defects
- 9.6.2.5 External protection diode contact area defects
- 9.6.3 Dimensions and weight (DW)
- 9.6.4 Thermal cycling (CY) [Go to Page]
- 9.6.4.1 Purpose
- 9.6.4.2 Process
- 9.6.5 Burn in (BI) [Go to Page]
- 9.6.5.1 Purpose
- 9.6.5.2 Process
- 9.6.6 Humidity and temperature [Go to Page]
- 9.6.6.1 HT1 for qualification testing (subgroup O)
- 9.6.6.2 HT2 for acceptance testing
- 9.6.7 Contact uniformity (CU) [Go to Page]
- 9.6.7.1 Purpose
- 9.6.7.2 Process
- 9.6.7.3 Pass Fail Criteria
- 9.6.8 Contact thickness (CT) [Go to Page]
- 9.6.8.1 Purpose
- 9.6.8.2 Process
- 9.6.8.3 Pass Fail Criteria
- 9.6.9 Surface Finish (SF) [Go to Page]
- 9.6.9.1 Purpose
- 9.6.9.2 Process
- 9.6.9.3 Pass Fail Criteria
- 9.6.10 Contact adherence (CA) [Go to Page]
- 9.6.10.1 Purpose
- 9.6.10.2 Process
- 9.6.11 Pull test (PT) [Go to Page]
- 9.6.11.1 Purpose
- 9.6.11.2 Process
- 9.6.12 Electron irradiation (EI) [Go to Page]
- 9.6.12.1 Purpose
- 9.6.12.2 Process
- 9.6.13 Temperature annealing (TA) [Go to Page]
- 9.6.13.1 Purpose
- 9.6.13.2 Process
- 9.6.14 Temperature behaviour (TB) [Go to Page]
- 9.6.14.1 Purpose
- 9.6.14.2 Process
- 9.6.15 Diode characterization (DC) [Go to Page]
- 9.6.15.1 Purpose
- 9.6.15.2 Process
- 9.6.15.3 Pass-fail criteria
- 9.6.16 Human body ESD (DE) [Go to Page]
- 9.6.16.1 Purpose
- 9.6.16.2 Process
- 9.6.16.3 Pass-fail criteria
- 9.6.17 Switching test (DS) [Go to Page]
- 9.6.17.1 Purpose
- 9.6.17.2 Process
- 9.6.17.3 Pass-fail criteria
- 9.6.18 Long Duration – Life test (LT) [Go to Page]
- 9.6.18.1 Purpose
- 9.6.18.2 Process
- 9.6.18.3 Pass-fail criteria
- 9.7 Failure definition [Go to Page]
- 9.7.1 Failure criteria
- 9.7.2 Failed components
- 9.8 Data documentation
- 9.9 Delivery
- 9.10 Packing, despatching, handling and storage [Go to Page]
- 9.10.1 Overview
- 9.10.2 ESD sensitivity
- 10 Solar simulators and calibration procedures [Go to Page]
- 10.1 Solar simulators [Go to Page]
- 10.1.1 Spectral distribution [Go to Page]
- 10.1.1.1 AM0 spectrum
- 10.1.1.2 Total Irradiance of the Solar simulator
- 10.1.1.3 Spectral distribution of the Solar simulator
- 10.1.2 Irradiance uniformity
- 10.1.3 Irradiance stability
- 10.2 Standard cell and Solar simulator calibration [Go to Page]
- 10.2.1 Primary standards
- 10.2.2 Secondary working standards (SWS) [Go to Page]
- 10.2.2.1 Selection of secondary working standards
- 10.2.2.2 <
> - 10.2.2.3 Secondary working standards performance requirements
- 10.2.3 Standards cells documentation
- 10.2.4 Maintenance of standards
- 10.2.5 Recalibration and intercomparison
- 10.2.6 Solar simulator calibration and maintenance [Go to Page]
- 10.2.6.1 Solar simulator calibration
- 10.2.6.2 Solar simulator maintenance
- 11 Capacitance measurement methods [Go to Page]
- 11.1 Single junction solar cell capacitance measurement [Go to Page]
- 11.1.1 Overview [Go to Page]
- 11.1.1.1 General
- 11.1.1.2 Description
- 11.1.2 Signal measurement method
- 11.1.3 Measurement procedure [Go to Page]
- 11.1.3.1 Preparation of the measurement equipment
- 11.1.3.2 Process for calibration of the test equipment
- 11.1.3.3 Measurement of the cell with the network analyser
- 11.1.4 Measurement analysis [Go to Page]
- 11.1.4.1 Correction of the measurement with respect to the actual impedance of the shunt (impedance values from the B/A measurements)
- 11.1.4.2 Modelling
- 11.1.5 Measurement of the capacitance of a multi-junction cell
- 11.2 Time domain capacitance measurement [Go to Page]
- 11.2.1 Overview [Go to Page]
- 11.2.1.1 General
- 11.2.1.2 Description
- 11.2.2 Measurement procedure [Go to Page]
- 11.2.2.1 Measurement equipment set-up
- 11.2.2.2 Calibration of the measurement equipment
- 11.2.2.3 Performance measurement
- 11.2.2.4 Data processing
- 12 Planar Blocking Diodes [Go to Page]
- 12.1 Overview
- 12.2 Testing, deliverable components and Marking [Go to Page]
- 12.2.1 Testing [Go to Page]
- 12.2.1.1 Tests for qualification and procurement
- 12.2.1.2 Conditions and methods of tests
- 12.2.1.3 Responsibility of supplier for the performance of tests and inspections
- 12.2.2 Deliverable components
- 12.2.3 Marking
- 12.3 Production control (process identification document)
- 12.4 Acceptance test [Go to Page]
- 12.4.1 General
- 12.4.2 Planar blocking diodes
- 12.5 Qualification tests [Go to Page]
- 12.5.1 General
- 12.5.2 Blocking diodes
- 12.5.3 Production and test schedule
- 12.5.4 Qualification test samples
- 12.5.5 Qualification testing
- 12.6 Test methods, conditions and measurements [Go to Page]
- 12.6.1 Visual inspection (VI) [Go to Page]
- 12.6.1.1 Process
- 12.6.1.2 Deviations
- 12.6.1.3 Defects
- 12.6.2 Dimensions and weight (DW)
- 12.6.3 Diode characterization (DC) [Go to Page]
- 12.6.3.1 Purpose
- 12.6.3.2 Process
- 12.6.3.3 Pass/fail criteria
- 12.6.4 Humidity and Temperature [Go to Page]
- 12.6.4.1 HT1 for qualification testing (subgroup O)
- 12.6.4.2 HT2 for acceptance testing
- 12.6.5 Temperature Cycling (CY) [Go to Page]
- 12.6.5.1 Purpose
- 12.6.5.2 Process
- 12.6.6 Contact Adherence (CA) [Go to Page]
- 12.6.6.1 Purpose
- 12.6.6.2 Process
- 12.6.6.3 Pass/fail criteria
- 12.6.7 Burn-in (BI) [Go to Page]
- 12.6.7.1 Purpose
- 12.6.7.2 Power Burn-in (FWD-BI)
- 12.6.7.3 High Temperature Reverse Bias Burn-in (HTRB-BI)
- 12.6.8 Long duration-Life Test (LT) [Go to Page]
- 12.6.8.1 Purpose
- 12.6.8.2 Process
- 12.6.8.3 Pass/fail criteria
- 12.6.9 Temperature behaviour test (TB) [Go to Page]
- 12.6.9.1 Purpose
- 12.6.9.2 Process
- 12.6.10 Temperature robustness test (TR) [Go to Page]
- 12.6.10.1 Purpose
- 12.6.10.2 Process
- 12.6.11 Total Dose Radiation Testing (RT) [Go to Page]
- 12.6.11.1 Ionising radiation test
- 12.6.11.2 Non-ionising radiation test
- 12.6.12 Temperature Annealing (TA) [Go to Page]
- 12.6.12.1 Purpose
- 12.6.12.2 Process
- 12.6.13 Contact uniformity test (CU) [Go to Page]
- 12.6.13.1 Purpose
- 12.6.13.2 Process
- 12.6.13.3 Pass-fail criteria
- 12.6.14 Surface Finish test (SF) [Go to Page]
- 12.6.14.1 Purpose
- 12.6.14.2 Process
- 12.6.14.3 Pass-fail criteria
- 12.6.15 Human Body ESD test (ESD) [Go to Page]
- 12.6.15.1 Purpose
- 12.6.15.2 Process
- 12.6.15.3 Pass-fail criteria
- 12.6.16 Pull test (PT) / Interconnector adherence test (IA) [Go to Page]
- 12.6.16.1 Purpose
- 12.6.16.2 Process
- 12.6.16.3 Pass-fail criteria
- 12.6.17 Surge test (ST) [Go to Page]
- 12.6.17.1 Purpose
- 12.6.17.2 Process
- 12.6.17.3 Pass-Fail criteria
- 12.6.18 Thermo-optical data (TO) [Go to Page]
- 12.6.18.1 Purpose
- 12.6.18.2 Process
- 12.6.18.3 Pass-fail criteria
- 12.7 Failure definition [Go to Page]
- 12.7.1 Failure criteria
- 12.7.2 Failed Blocking Diodes
- 12.8 Data documentation
- 12.9 Delivery
- 12.10 Packing, despatching, handling and storage [Go to Page]
- 12.10.1 Overview
- 12.10.2 ESD sensitivity [Go to Page]
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