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BS EN 16602-70-61:2022 Space product assurance. High-reliability soldering for surface mount, mixed technology and hand-mounted electrical connections, 2022
- undefined
- 1 Scope
- 2 Normative references
- 3 Terms, definitions and abbreviated terms [Go to Page]
- 3.1 Terms from other standards
- 3.2 Terms specific to the present standard
- 3.3 Abbreviated terms
- 3.4 Nomenclature
- 4 Principles of reliable soldered connections
- 5 Preparatory conditions [Go to Page]
- 5.1 Facility cleanliness
- 5.2 Environmental conditions
- 5.3 Lighting requirements
- 5.4 Precautions against static discharges [Go to Page]
- 5.4.1 Overview
- 5.4.2 General
- 5.4.3 ESD Protected Area
- 5.4.4 Precautions against ESD during manufacturing
- 5.4.5 Protective packaging and ESD protection
- 5.5 Equipment and tools [Go to Page]
- 5.5.1 General
- 5.5.2 Brushes
- 5.5.3 Cutters and pliers
- 5.5.4 Bending tools
- 5.5.5 Clinching tools
- 5.5.6 Insulation strippers [Go to Page]
- 5.5.6.1 Thermal strippers
- 5.5.6.2 Precision mechanical cutting-type strippers
- 5.5.6.3 Enamel stripping for wires
- 5.5.6.4 Verification of stripping tools
- 5.5.7 Hot air blower
- 5.5.8 Soldering tools [Go to Page]
- 5.5.8.1 General
- 5.5.8.2 Holding tools
- 5.5.8.3 Thermal shunts
- 5.5.8.4 Anti-wicking tools
- 5.5.8.5 Soldering irons
- 5.5.9 Baking and curing ovens
- 5.5.10 Solder deposition equipment
- 5.5.11 Automatic component placement equipment
- 5.5.12 Dynamic wave-solder machines
- 5.5.13 Selective wave solder equipment
- 5.5.14 Reflow process equipment [Go to Page]
- 5.5.14.1 Condensation (vapour phase) reflow machines
- 5.5.14.2 Local hot gas reflow machines
- 5.5.14.3 Forced convection and infrared reflow systems
- 5.5.14.4 Other equipment for reflow soldering
- 5.5.14.5 Reflow process control parameters
- 5.5.15 Depanelization tool
- 5.5.16 Cleanliness testing equipment
- 5.5.17 Optical microscope
- 5.5.18 Automatic Optical Inspection (AOI) equipment
- 5.5.19 X-ray inspection equipment
- 6 Material selection [Go to Page]
- 6.1 General
- 6.2 Solder [Go to Page]
- 6.2.1 Form
- 6.2.2 Composition
- 6.2.3 Storage and handling of paste purity
- 6.3 Fluxes [Go to Page]
- 6.3.1 Rosin based fluxes
- 6.4 Solvents
- 6.5 Flexible insulation materials
- 6.6 Terminals [Go to Page]
- 6.6.1 Materials
- 6.6.2 Tin, silver, and gold-plated terminals
- 6.7 Wires
- 6.8 Sculptured flex
- 6.9 Printed circuits substrates [Go to Page]
- 6.9.1 Substrates selection
- 6.9.2 Gold finish on PCBs footprint
- 6.9.3 PCB design requirements for wave and selective wave soldering
- 6.10 Components [Go to Page]
- 6.10.1 General
- 6.10.2 Moisture sensitive components
- 6.11 Adhesives, potting, underfill and conformal coatings
- 7 Preparations prior to mounting and soldering [Go to Page]
- 7.1 General handling
- 7.2 Storage [Go to Page]
- 7.2.1 Components
- 7.2.2 PCBs
- 7.2.3 Materials requiring segregation
- 7.3 Baking conditions of PCBs
- 7.4 Baking and storage of moisture sensitive components
- 7.5 Preparation of components, wires, terminals, and solder cups [Go to Page]
- 7.5.1 Damage to insulation
- 7.5.2 Damage to conductors and braid
- 7.5.3 Cleaning before soldering
- 7.5.4 Insulation clearance
- 7.5.5 Wire lay
- 7.6 Degolding and pretinning [Go to Page]
- 7.6.1 General
- 7.6.2 Solder baths method for degolding and pretinning of components terminations and terminals
- 7.6.3 Solder iron method for degolding and pretinning [Go to Page]
- 7.6.3.1 PCB
- 7.6.3.2 Components terminations
- 7.6.3.3 Solder cup
- 7.6.4 Pretinning processes [Go to Page]
- 7.6.4.1 Pretinning of pure tin finish component leads
- 7.6.4.2 Solder bath method for pretinning of stranded wires
- 7.6.4.3 Solder iron method for pretinning of wires and braids
- 7.6.4.4 Requirements for pretinning of wires
- 7.7 Preparation of the soldering tip
- 8 Components mounting requirements prior to soldering [Go to Page]
- 8.1 General requirements
- 8.2 Mounting of through hole components [Go to Page]
- 8.2.1 General
- 8.2.2 Heavy components
- 8.2.3 Metal-case components
- 8.2.4 Glass-encased components
- 8.2.5 Stress relief of components with bendable leads
- 8.2.6 Stress relief of components with non-bendable leads
- 8.2.7 Bending of component leads
- 8.2.8 Lead attachment to PCBs [Go to Page]
- 8.2.8.1 General
- 8.2.8.2 Stud leads
- 8.2.8.3 Clinching of components in non-plated through holes
- 8.2.9 Mounting of through hole connectors to PCBs
- 8.2.10 Mounting of swage terminals to PCBs
- 8.2.11 Mounting of components to terminals
- 8.3 Mounting of surface mount components [Go to Page]
- 8.3.1 General
- 8.3.2 Lead forming
- 8.3.3 Inspection of solder paste deposition
- 9 Attachment of conductors to terminals, solder cups and cables [Go to Page]
- 9.1 General
- 9.2 Wire termination [Go to Page]
- 9.2.1 Breakouts from cables
- 9.2.2 Insulation clearance
- 9.3 Turret and straight-pin terminals
- 9.4 Bifurcated terminals [Go to Page]
- 9.4.1 General
- 9.4.2 Bottom route
- 9.4.3 Side route
- 9.4.4 Top route
- 9.4.5 Combination of top and bottom routes
- 9.4.6 Combination of side and bottom routes
- 9.5 Hook terminals
- 9.6 Pierced terminals
- 9.7 Solder cups for connector
- 9.8 Insulation sleeving
- 9.9 Wire and cable interconnections [Go to Page]
- 9.9.1 General
- 9.9.2 Preparation of wires
- 9.9.3 Preparation of shielded wires and cables
- 9.9.4 Pre-assembly of wires
- 9.10 Connection of wires to PCBs
- 9.11 Connection of coaxial cables to PCBs
- 10 Assembly to terminals and to PCBs [Go to Page]
- 10.1 Overview
- 10.2 General soldering conditions [Go to Page]
- 10.2.1 General
- 10.2.2 Positioning
- 10.2.3 Application of flux
- 10.2.4 Flux controls for wave-soldering equipment
- 10.2.5 Soldering temperatures
- 10.2.6 Soldering of conductors in terminals [Go to Page]
- 10.2.6.1 Soldering of conductors onto terminals except cup terminals
- 10.2.6.2 Soldering of conductors onto cup terminals
- 10.3 Soldering of components, terminals, and wires into PCB through holes [Go to Page]
- 10.3.1 General
- 10.3.2 Solder fillets for wires and terminations
- 10.3.3 Solder fillets for component leads in plated or non-plated through holes
- 10.4 Soldering of surface mount components [Go to Page]
- 10.4.1 General
- 10.4.2 Rectangular and square end-capped or end-metallized leadless chip
- 10.4.3 Cylindrical and square end-capped components with cylindrical or oval body
- 10.4.4 Bottom terminated chip components
- 10.4.5 L-Shape inwards components
- 10.4.6 Leadless component with plane termination
- 10.4.7 Leaded component with plane termination
- 10.4.8 Leadless castellated ceramic chip carrier components
- 10.4.9 No lead Quad Flat Pack
- 10.4.10 Flat pack and gull-wing leaded components with round, rectangular, ribbon leads
- 10.4.11 Components with “J” leads
- 10.4.12 Components with ribbon terminals without stress relief
- 10.4.13 Stacked modules components with leads protruding vertically from bottom
- 10.4.14 Area array devices
- 10.5 Rework and repair [Go to Page]
- 10.5.1 Removal of solder on unpopulated PCB
- 10.5.2 Rework, repair and modifications
- 10.6 High-voltage connections
- 10.7 Solderless components
- 11 Post soldering process requirements [Go to Page]
- 11.1 Cleaning of PCB assemblies [Go to Page]
- 11.1.1 General
- 11.1.2 Verification of cleanliness
- 11.1.3 Surface Insulation Resistance (SIR) testing
- 11.1.4 Sodium chloride (NaCl) equivalent ionic contaminants testing
- 11.1.5 Monitoring of cleanliness
- 11.2 Staking and bonding
- 11.3 Conformal coating, potting and underfill
- 12 Final inspection [Go to Page]
- 12.1 General
- 12.2 Visual acceptance criteria
- 12.3 Visual rejection criteria
- 12.4 X-ray rejection criteria
- 12.5 Warp and twist of populated boards
- 12.6 Inspection records
- 13 Verification procedure [Go to Page]
- 13.1 Verification approval procedure [Go to Page]
- 13.1.1 Request for verification
- 13.1.2 Technology sample [Go to Page]
- 13.1.2.1 Description of technology sample
- 13.1.2.2 Evaluation of technology sample
- 13.1.3 Audit of assembly processing
- 13.1.4 Verification programme documentation
- 13.1.5 Verification samples and testing
- 13.1.6 Final verification review
- 13.1.7 Approval status of assembly line
- 13.1.8 Withdrawal of approval status
- 13.2 Verification programme [Go to Page]
- 13.2.1 General
- 13.2.2 Verification for PTH manual soldering
- 13.2.3 Additional verification for wave soldering
- 13.2.4 Soldering log
- 13.3 Special verification testing for ceramic area array components [Go to Page]
- 13.3.1 General
- 13.3.2 Evaluation of AAD capability samples
- 13.3.3 Electrical verification of AAD assembly
- 13.4 Assembly verification with electrical testing procedure
- 13.5 Verification programme with reduced temperature range
- 13.6 Verification for solderless process
- 13.7 Conditions for delta verification
- 13.8 Verification by similarity [Go to Page]
- 13.8.1 General conditions for similarity
- 13.8.2 Conditions for similarity for PTH components
- 13.8.3 Conditions for similarity for SMD
- 13.8.4 Conditions for similarity for solderless components
- 14 Environmental tests conditions [Go to Page]
- 14.1 Overview
- 14.2 Visual inspection
- 14.3 X-ray inspection
- 14.4 Cleanliness test
- 14.5 Warp and twist of PCB
- 14.6 Electrical continuity measurement
- 14.7 Electrical continuity for wave soldered multilayers PCB
- 14.8 Vibration
- 14.9 Mechanical shock
- 14.10 Damp heat test
- 14.11 Temperature cycling test
- 14.12 Temperature cycling test with reduced temperature range
- 14.13 Life test
- 14.14 Final visual inspection
- 14.15 Microsection [Go to Page]
- 14.15.1 Microsection facilities
- 14.15.2 Microsections location
- 14.15.3 Microsection acceptance criteria [Go to Page]
- 14.15.3.1 General
- 14.15.3.2 Acceptance criteria
- 14.15.4 Microsection acceptance criteria for ceramic chip capacitors
- 14.16 Anomalies in PCB and sculptured flex during verification
- 15 Outsourcing [Go to Page]
- 15.1 General
- 16 Process identification document (PID) [Go to Page]
- 16.1 Overview
- 16.2 Document preparation
- 16.3 Approval
- 16.4 Contact person
- 16.5 Process identification document update
- 17 Quality assurance [Go to Page]
- 17.1 General
- 17.2 Data
- 17.3 Nonconformance
- 17.4 Calibration
- 17.5 Traceability
- 17.6 Workmanship standards
- 17.7 Inspection points
- 17.8 Operators, inspectors and instructors training and certification [Go to Page]
